Our Products
● Mobile Device
● Enterprise Solutions
● Medical Instrument
● Life Style Accessories
Our Processes
SMT
● Solder Paste Printing
● Solder Paste Inspection
● Chip/IC Placement
● Automatic Optical Inspection
● Reflow Oven
Assembly & Packaging
● Sub Assembly
● Full assembly
Board Level Testing
● Memory Flashing
● Base-band test
● RF Test
● BT/WIFI Test
Phone Level Testing
● LCD Calibration
● Antenna Test (Part Level)
● Camera Test
● Audio Test
● 2G/3G/LTE RF Test
● BT / WIFI Test
● 2G/3G/LTE CQA Test
● Customer S/W Download
Our Services
● End-to-end production capabilities including board level assemblies, modules assemblies and final product assemblies with test capabilities.
● Experienced and strong SCM team to support turnkey solutions for industrial and consumer products
● Product Validation
● Testing solution development
● Logistic management
● ISO 9001
● ISO 13485
● ISO 14001
● OHSAS 18001
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11 International Business Park, Jurong East, Singapore
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(65) 6268-5459
ICP NO.:17055302-1 Hi-P International © 2025
